ChipMOS Technologies Inc – (NASDAQ:IMOS) has earned an average broker rating score of 1.00 (Strong Buy) from the one analysts that provide coverage for the company, Zacks Investment Research reports.
Zacks has also assigned ChipMOS Technologies an industry rank of 262 out of 257 based on the ratings given to its competitors.
Several analysts recently commented on the stock. BidaskClub upgraded shares of ChipMOS Technologies from a “strong sell” rating to a “sell” rating in a research report on Wednesday, August 8th. ValuEngine lowered shares of ChipMOS Technologies from a “hold” rating to a “sell” rating in a research report on Wednesday, September 12th.
IMOS stock traded down $0.50 during midday trading on Friday, hitting $17.01. 3,096 shares of the stock traded hands, compared to its average volume of 20,568. The firm has a market cap of $618.49 million, a PE ratio of 15.18 and a beta of 0.74. The company has a debt-to-equity ratio of 0.54, a quick ratio of 1.93 and a current ratio of 2.24. ChipMOS Technologies has a 1-year low of $12.26 and a 1-year high of $18.69.
ChipMOS Technologies (NASDAQ:IMOS) last released its quarterly earnings results on Thursday, November 8th. The semiconductor company reported $0.36 EPS for the quarter, beating the Thomson Reuters’ consensus estimate of $0.31 by $0.05. The company had revenue of $5.01 billion for the quarter, compared to analyst estimates of $5.02 billion. ChipMOS Technologies had a net margin of 4.14% and a return on equity of 4.08%. The firm’s revenue was up 13.0% on a year-over-year basis. During the same quarter last year, the business earned $0.25 earnings per share.
ChipMOS Technologies Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors.
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