ASE Technology Holding Co Ltd (NYSE:ASX) has been given a consensus rating of “Hold” by the eight research firms that are covering the firm, MarketBeat Ratings reports. Two analysts have rated the stock with a sell rating, one has assigned a hold rating and four have assigned a buy rating to the company. The average 1 year price objective among brokerages that have updated their coverage on the stock in the last year is $30.00.
A number of research analysts have recently commented on ASX shares. Goldman Sachs Group started coverage on ASE Technology in a research report on Wednesday, September 4th. They set a “buy” rating on the stock. Macquarie raised ASE Technology from an “underperform” rating to an “outperform” rating in a research report on Thursday, August 1st. Morgan Stanley cut ASE Technology from an “overweight” rating to an “equal” rating in a research report on Monday, September 23rd. HSBC raised ASE Technology from a “hold” rating to a “buy” rating in a research report on Thursday, August 1st. Finally, ValuEngine raised ASE Technology from a “strong sell” rating to a “sell” rating in a report on Tuesday, November 5th.
Shares of NYSE ASX traded down $0.11 during trading on Tuesday, reaching $5.12. 336,537 shares of the stock traded hands, compared to its average volume of 639,700. ASE Technology has a 52-week low of $3.46 and a 52-week high of $5.31. The company has a debt-to-equity ratio of 0.65, a current ratio of 1.14 and a quick ratio of 0.88. The company has a 50-day moving average of $4.87 and a 200-day moving average of $4.39. The stock has a market capitalization of $11.11 billion, a P/E ratio of 13.13, a price-to-earnings-growth ratio of 8.60 and a beta of 0.97.
About ASE Technology
ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions.
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